11/20/2023 0 Comments Still air incubator reviewsWhat’s Your Process for Developing a Strategy? with Tim Rodgers.Jet Appeal, with Carsten Sundin, Aaron Park, Austin Alley, and John Smoker.TTM CEO Tom Edman on the Process of Strategy, with Tom Edman.Innovations in Final Finishing, with Mike Brask.A Look Inside SEL’s New PCB Factory, with John Hendrickson and Mike Brask.Discussing SEL’s Strategy, with David Whitehead.This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies. A solid strategy is a critical part of success. Today’s PCB fabricators face a variety of market and supply chain obstacles in addition to competitors down the street and overseas. Culture by Design: Building a Winning Team from the Start by Brian Wallace.Computer-Aided Bare Board Testing, Revisited by Happy Holden.Processes to Support IC Substrates and Advanced Packaging, Part 4 by Mike Carano.Don’t Just Blame the Etcher by Don Ball.The Pros and Cons of Tribal Knowledge by Paige Fiet.Chemcut: Blending Capabilities and Culture.Atotech: More Horizontal Panel Plating in the U.S.Notion Systems: The Arrival of the ‘Jet Age’.GreenSource Engineering: An Eye on Design.Building a Domestic ‘Silicon to Systems’ Ecosystem by Matt Kelly.Pivoting on Substrates interview with Oved Shapira.Cutting-edge Inspection Challenges by Brent Fischthal.The Drive Toward UHDI and Substrates interview with Darren Hitchcock.We also bring you special coverage with conversations from some of the suppliers to the ultra-modern fab and assembly facility in Moscow, Idaho, built by Schweitzer Engineering Laboratories. In this issue, we look at materials, advanced packaging and UHDI fundamentals from multiple directions with industry voices ranging from fabricators to equipment manufacturers, to industry advocates. And then there’s the impact of the CHIPS Act. New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. AI Revolution Reshaping the Future of PCB Manufacturing, by Val Kaplan.Meet the New Workforce at IPS, by Barry Matties.What We Learned at PCB West, by Travis Kelly. ![]() Reimagining PCB Design in Education, by Hannah Nelson.Large Panel Processing, by Happy Holden.Reliability of Printed Circuit Boards, by Reza Ghaffarian.Planning, DFM, and Inspection: Keys to High-reliability Fab, with Marc L’Hoste.Financial Risks of Ignoring Copper Grain, by Alex Stepinski.The Material Science of PCB Thermal Reliability, by Preeya Kuray.High-Reliability Fab Overview, with Alex Stepinski.Exploring High-Reliability Fabrication, by Andy Shaughnessy.We also detail the tradeoffs involved in maximizing reliability while reducing your costs and introduce you to experts and resources that can help you raise your reliability levels. In this month’s issue, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication. What do we mean by high reliability? How much investment does it take for a traditional board shop to move into the ‘high-rel’ realm? How do you measure reliability failure? And after four years of research, why can’t the North American fab industry figure out the root cause of microvia failures? High-reliability fabrication presents a number of challenges and tradeoffs for fabricators, along with a myriad of market opportunities.
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